Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper

Jianwei Li; Chaogang Ding; Wanji Chen; Debin Shan; Bin Guo; Jie Xu

Materials & Design (May 2023)

Strain localization and ductile fracture mechanism of micro/mesoscale deformation in ultrafine-grained pure copper

Jianwei Li,
Chaogang Ding,
Wanji Chen,
Debin Shan,
Bin Guo,
Jie Xu

Affiliations

Jianwei Li: Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China; School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China; Beijing Hangxing Machinery Manufacture Limited Corporation, Beijing 100013, China
Chaogang Ding: Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China; School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China; Corresponding authors.
Wanji Chen: Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China; School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China
Debin Shan: Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China; School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China
Bin Guo: Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China; School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China
Jie Xu: Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China; School of Materials Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, China; Corresponding authors.

Journal volume & issue: Vol. 229
p. 111873

Abstract

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To realize the application of ultrafine-grained (UFG) materials in micro-forming, the micro/meso-deformation and fracture behavior of UFG pure copper processed using equal-channel angular pressing were analyzed by making in/ex-situ observations during tensile testing. The evolution of surface cracks and inner voids was apparent in the in-situ scanning electron microscopy (SEM) images and synchrotron radiation X-ray tomograms, respectively. The results indicate that the surface-crack evolution of UFG pure copper can be correlated with strain localization when the flow stress decreases after peaking. The effects of grain size and shear texture on damage evolution during the fracture process are also discussed. This work comprehensively explores the plasticity and fracture/failure mechanisms in UFG Cu samples during the micro-forming process.

Published in Materials & Design

ISSN: 0264-1275 (Print); 1873-4197 (Online)
Publisher: Elsevier
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: https://www.journals.elsevier.com/materials-and-design

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