Fine Electrolytic Tough Pitch Copper Multistage Wiredrawing Pass Schedule Design by Analytical and Numerical Methods

Abstract

Electrolytic tough pitch copper is commonly used in electric and electronic applications while fine copper wires are widely used in electronic conductors. A multi-pass wiredrawing process was designed for the manufacturing of fine pure copper wire, from 0.50 mm to 0.10 mm in diameter. The analytical model and the finite element analysis (FEA) were performed to validate the pass schedule design. The initial wire was mechanically characterized, and the pass schedule design was stablished by the analytical method according to the specific criteria. The sequence of wiredrawing passes was modeled in the finite element method (FEM) software in order to analyze and validate the designed pass schedule. The combination of these methods allowed designing and validating the wiredrawing pass schedule to implement it in a real process with guaranteed results. This work contributes in showing a combined methodology for the design and virtual validation of the pass schedule in the case of multistage wiredrawing of ETP copper fine wires.

Keywords

• multi-pass wire drawing process
• Deform2D
• fine ETP copper wire
• slab method
• finite element method