The softening behavior of a cold-drawn Cu–Cr–In alloy was investigated during annealing between 450 °C and 700 °C. The properties and microstructure evolution of the alloy were characterized using a microhardness tester, electron back-scatter diffraction, and transmission electron microscopy. Elemental In addition was found to hinder the dislocation movement and delay the recovery and recrystallization of the Cu–Cr–In alloy. The experimental data were analyzed using the Johnson–Mehlv–Avramiv–Kolmogorov model. The activation energy of recrystallization of the 60% cold-drawn Cu0.54Cr0.17In alloy was 188.29 ± 18.44 kJ/mol, and the recrystallization mechanism of the alloy was attributed mainly to Cu self-diffusion.
