Dielectric, mechanical and thermal properties of all-organic PI/PSF composite films by in situ polymerization
Li Peng,
Yu Jiajun,
Jiang Shaohua,
Fang Hong,
Liu Kunming,
Hou Haoqing
Affiliations
Li Peng
College of Chemistry and Chemical Engineering, Jiangxi Normal University, Nanchang 330022, China
Yu Jiajun
College of Chemistry and Chemical Engineering, Jiangxi Normal University, Nanchang 330022, China
Jiang Shaohua
Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, College of Materials Science and Engineering, Nanjing Forestry University, Nanjing 210037, China
Fang Hong
College of Chemistry and Chemical Engineering, Jiangxi Normal University, Nanchang 330022, China
Liu Kunming
School of Metallurgical and Chemical Engineering, Jiangxi University of Science and Technology, Ganzhou 341000, China
Hou Haoqing
College of Chemistry and Chemical Engineering, Jiangxi Normal University, Nanchang 330022, China
All-organic high dielectric materials are highly required in the field of modern electronic industry and energy storage. In this work, all-organic polyimide/polysulfone composite films with different amounts of PSF (PI/PSF-X) were prepared by in situ polymerization followed by film casting and thermal treatment. The dielectric, mechanical and thermal properties of these PI/PSF-X composite films are characterized by dielectric measurement, tensile test, thermogravimetric analysis and dynamic mechanical analysis. The results suggest that the PI/PSF-X composite films have good dielectric properties, good mechanical properties and excellent thermal properties, which are suitable for applications in electronic devices in harsh environments, especially in high-temperature environments.
