Boosting flexible electronics with integration of two‐dimensional materials
Chongyang Hou,
Shuye Zhang,
Rui Liu,
Thomas Gemming,
Alicja Bachmatiuk,
Hongbin Zhao,
Hao Jia,
Shirong Huang,
Weijia Zhou,
Jian‐Bin Xu,
Jinbo Pang,
Mark H. Rümmeli,
Jinshun Bi,
Hong Liu,
Gianaurelio Cuniberti
Affiliations
Chongyang Hou
Institute for Advanced Interdisciplinary Research (iAIR) University of Jinan Jinan the People’s Republic of China
Shuye Zhang
State Key Laboratory of Advanced Welding and Joining Harbin Institute of Technology Harbin the People’s Republic of China
Rui Liu
Institute for Advanced Interdisciplinary Research (iAIR) University of Jinan Jinan the People’s Republic of China
Thomas Gemming
Institute for Materials Chemistry Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden) Dresden Germany
Alicja Bachmatiuk
Lukasiewicz Research Network PORT Polish Center for Technology Development Wroclaw Poland
Hongbin Zhao
State Key Laboratory of Advanced Materials for Smart Sensing GRINM Group Co. Ltd Beijing the People’s Republic of China
Hao Jia
State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences Shanghai the People’s Republic of China
Shirong Huang
Institute for Materials Science and Max Bergmann Center of Biomaterials TUD Dresden University of Technology Dresden Germany
Weijia Zhou
Institute for Advanced Interdisciplinary Research (iAIR) University of Jinan Jinan the People’s Republic of China
Jian‐Bin Xu
Department of Electronic Engineering The Chinese University of Hong Kong Hong Kong SAR the People’s Republic of China
Jinbo Pang
Institute for Advanced Interdisciplinary Research (iAIR) University of Jinan Jinan the People’s Republic of China
Mark H. Rümmeli
Institute for Materials Chemistry Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden) Dresden Germany
Jinshun Bi
School of Integrated Circuits University of Chinese Academy of Sciences Beijing the People’s Republic of China
Hong Liu
Institute for Advanced Interdisciplinary Research (iAIR) University of Jinan Jinan the People’s Republic of China
Gianaurelio Cuniberti
Institute for Materials Science and Max Bergmann Center of Biomaterials TUD Dresden University of Technology Dresden Germany
Abstract Flexible electronics has emerged as a continuously growing field of study. Two‐dimensional (2D) materials often act as conductors and electrodes in electronic devices, holding significant promise in the design of high‐performance, flexible electronics. Numerous studies have focused on harnessing the potential of these materials for the development of such devices. However, to date, the incorporation of 2D materials in flexible electronics has rarely been summarized or reviewed. Consequently, there is an urgent need to develop comprehensive reviews for rapid updates on this evolving landscape. This review covers progress in complex material architectures based on 2D materials, including interfaces, heterostructures, and 2D/polymer composites. Additionally, it explores flexible and wearable energy storage and conversion, display and touch technologies, and biomedical applications, together with integrated design solutions. Although the pursuit of high‐performance and high‐sensitivity instruments remains a primary objective, the integrated design of flexible electronics with 2D materials also warrants consideration. By combining multiple functionalities into a singular device, augmented by machine learning and algorithms, we can potentially surpass the performance of existing wearable technologies. Finally, we briefly discuss the future trajectory of this burgeoning field. This review discusses the recent advancements in flexible sensors made from 2D materials and their applications in integrated architecture and device design.