Temperature and Dilatation Estimation for Modern Semiconductor Devices

Abstract

This paper presents a new approach for measuring physical variables on micro- electronic components. An optical system is used to simultaneously quantify the surface temperature of a component and its expansion. This double acquisition is realized by a Michelson interferometer coupled with a Charge Coupled Device (CCD) line device. To validate this method, the temperature measurements were directly compared with the results obtained by an infrared camera and by a measurement of variation of I (V). The displacement measurements were compared with those obtained by a laser 3D vibrometer, whose physical principle is completely different. Consistent results were obtained regarding the different techniques.

Keywords

• Thermal measurement
• Laser
• Electronic components.