Packaging and Antenna-Assembled Hybrid Stacked PCB with Novel Vertical Transition for 39 GHz 5G Base Stations

Abstract

This paper proposes a novel packaging and large-scale antenna-assembled structure for a printed circuit board (PCB) that reinforces productivity, facilitates cost reduction, and maintains reliability. This was achieved by splitting the antenna from the main board and packaging it into a radio-frequency integrated circuit. In addition, two innovative solutions—an externally attachable flexible PCB antenna and a PCB-embedded coaxial line—are introduced to overcome the degradation in antenna performance and vertical RF transition loss in the proposed low-cost hybrid PCB. First, the proposed externally attachable flexible PCB antenna and a parasitic air-coupled antenna, which were easily assembled on the PCB, achieved an antenna efficiency of 95% and an impedance bandwidth of 7 GHz. Second, the fabricated coaxial line exhibited enhanced impedance matching over a wide frequency range of 30–40 GHz and improved insertion loss of approximately 1.4 dB. Furthermore, the packaged antenna, composed of 256 dual-polarized antenna elements per stream, incorporated a 39 GHz CMOS-based 16-channel phased-array transceiver IC. The set-level beam-forming measurements were verified considering an effective isotropic radiated power of 55 dBm at boresight and a steering range >±60°. In addition to being suitable for mass production in terms of cost and reliability, the proposed structures and solutions met the required antenna and beam-forming performance for commercial 39 GHz base stations without sacrificing performance.

Keywords

• antenna-in-package
• antenna-on-pcb phased array
• base station antenna
• vertical transition feedline
• 5g mmwave antenna