Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder

Huigai Wang; Keke Zhang; Yongjin Wu; Bingying Wang

Materials & Design (Dec 2021)

Study on the correlation between spreadability and wetting driving force of Ni-GNSs reinforced SnAgCuRE composite solder

Huigai Wang,
Keke Zhang,
Yongjin Wu,
Bingying Wang

Affiliations

Huigai Wang: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471000, China; Collaborative Innovation Center of Nonferrous Metals, Henan Key Laboratory of Nonferrous Materials Science & Processing Technology, Luoyang 471000, China; Corresponding authors at: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471000, China.
Keke Zhang: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471000, China; Collaborative Innovation Center of Nonferrous Metals, Henan Key Laboratory of Nonferrous Materials Science & Processing Technology, Luoyang 471000, China; Corresponding authors at: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471000, China.
Yongjin Wu: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471000, China
Bingying Wang: School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471000, China

Journal volume & issue: Vol. 212
p. 110222

Abstract

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To save test time and cost, spreading area method and wetting balance method were used to study the wetting characteristics of Ni-GNSs/SnAgCuRE composite solder under different parameters and explore the correlation between spreadability and wetting driving force of the composite solder. The results showed that the composite solder had good spreadability on the Cu substrate under 270–280 °C and water-clean flux, and they had good wetting adaptability to Cu wire under the tin bath temperature of 270–280 °C, dipping time of 6 s and dipping speed of 20 mm/s. The results satisfied the requirements of production in micro-connection field. The dynamic spreading processes of Ni-GNSs/SnAgCuRE composite solder consisted of three stages: initial slow shrinkage, rapid expansion and gradual equilibrium. Added appropriate amount of Ni-GNSs into the solder alloy, they adsorbed on the surface of Ag3Sn particles to form a precursor film at the three-phase interface, which was conducive to spread. The correlation equation between spreadability and wetting driving force of composite solder was established. According to the spreading area of the composite solder on the Cu substrate, the wetting driving force and wetting balance of the immersion wetting processes could be analyzed and vice versa.

Published in Materials & Design

ISSN: 0264-1275 (Print); 1873-4197 (Online)
Publisher: Elsevier
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: https://www.journals.elsevier.com/materials-and-design

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