Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

How Yuan Hwang; Jun Su Lee; Tae Joon Seok; Alex Forencich; Hannah R. Grant; Dylan Knutson; Niels Quack; Sangyoon Han; Richard S. Muller; George C. Papen; Ming C. Wu; Peter O'Brien

doi:10.1109/JPHOT.2017.2704097

IEEE Photonics Journal (Jan 2017)

Flip Chip Packaging of Digital Silicon Photonics MEMS Switch for Cloud Computing and Data Centre

How Yuan Hwang,
Jun Su Lee,
Tae Joon Seok,
Alex Forencich,
Hannah R. Grant,
Dylan Knutson,
Niels Quack,
Sangyoon Han,
Richard S. Muller,
George C. Papen,
Ming C. Wu,
Peter O'Brien

Affiliations

How Yuan Hwang: Tyndall National Institute, University College Cork, Cork, Ireland
Jun Su Lee: Tyndall National Institute, University College Cork, Cork, Ireland
Tae Joon Seok: Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA
Alex Forencich: Department of Electrical and Computer Engineering, University of California, San Diego, CA, USA
Hannah R. Grant: Department of Electrical and Computer Engineering, University of California, San Diego, CA, USA
Dylan Knutson: Department of Electrical and Computer Engineering, University of California, San Diego, CA, USA
Niels Quack: Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA
Sangyoon Han: Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA
Richard S. Muller: Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA
George C. Papen: Department of Electrical and Computer Engineering, University of California, San Diego, CA, USA
Ming C. Wu: Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA, USA
Peter O'Brien: Tyndall National Institute, University College Cork, Cork, Ireland

DOI: https://doi.org/10.1109/JPHOT.2017.2704097
Journal volume & issue: Vol. 9, no. 3
pp. 1 – 10

Abstract

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We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 × 12 switching ports. The challenges in packaging N 2 electrical and 2N optical interconnections are addressed with single-layer electrical redistribution lines of 25 μm line width and space on aluminum nitride interposer and 13° polished 64-channel lidless fiber array (FA) with a pitch of 127 μm. 50 μm diameter solder spheres are laser-jetted onto the electrical bond pads surrounded by suspended MEMS actuators on the device before fluxless flip-chip bonding. A lidless FA is finally coupled near-vertically onto the device gratings using a 6-degree-of-freedom (6-DOF) alignment system. Fiber-to-grating coupler loss of 4.25 dB/facet, 10–11 bit error rate (BER) through the longest optical path, and 0.4 μs switch reconfiguration time have been demonstrated using 10 Gb/s Ethernet data stream.

Published in IEEE Photonics Journal

ISSN: 1943-0655 (Online)
Publisher: IEEE
Country of publisher: United States
LCC subjects: Technology: Engineering (General). Civil engineering (General): Applied optics. Photonics; Science: Physics: Optics. Light
Website: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=4563994

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