Nauka i Tehnika (Feb 2009)
KINEMATICS MODELING OF MAGNETIC AND ABRASIVE SILICON WAFER POLISHING
Abstract
The paper considers possibilities to apply magnetic-abrasive machining method as one of the final operations for polishing flat surfaces of silicon wafers. A mathematical model has been built that reflects main principles of tool-work-piece interactions. A methodology has been developed that permits to give both qualitative and quantitative evaluation of material removal rate. Optimization of technological parameters for a 3905-model machine tool has been carried out with the help of a special software. It has been proved both in theory and experiments that applying magnetic and abrasive polishing of silicon wafers average value of planeness deviation corresponds to SEMI standards.