Nauka i Tehnika (Feb 2009)

KINEMATICS MODELING OF MAGNETIC AND ABRASIVE SILICON WAFER POLISHING

  • R. V. Fedortsev,
  • N. S. Khomich,
  • A. I. Lougovik,
  • A. E. Korzun,
  • P. V. Kukhto

Journal volume & issue
Vol. 0, no. 1
pp. 32 – 38

Abstract

Read online

The paper considers possibilities to apply magnetic-abrasive machining method as one of the final operations for polishing flat surfaces of silicon wafers. A mathematical model has been built that reflects main principles of tool-work-piece interactions. A methodology has been developed that permits to give both qualitative and quantitative evaluation of material removal rate. Optimization of technological parameters for a 3905-model machine tool has been carried out with the help of a special software. It has been proved both in theory and experiments that applying magnetic and abrasive polishing of silicon wafers average value of planeness deviation corresponds to SEMI standards.