IEEE Access (Jan 2021)

Novel Multiple-Layer Stack Capacitor and Its Application in the IRPFA Readout Circuit

  • Qi Liu,
  • Tuanzhuang Wu,
  • Yanfeng Ma,
  • Siyang Liu,
  • Xiaojuan Xia,
  • Weifeng Sun

DOI
https://doi.org/10.1109/ACCESS.2021.3132490
Journal volume & issue
Vol. 9
pp. 161806 – 161813

Abstract

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In this paper, a kind of four-layer stack capacitor is proposed, which has realized the compatibility with the conventional standard $0.5~\mu \text{m}$ CMOS technology. The effective capacitance per area of the proposed stack capacitor is about three times larger than that of the mono-layer MOS capacitor. The Simulation Program with Integrated Circuit Emphasis (SPICE) model of the presented four-layer stack capacitor has been also established with considering the fringe effect. The results show that the root mean square error of the proposed SPICE model is less than 2%. The model has been applied in the simulation design of the infrared focal plane array readout circuit (IRFPA ROIC) successfully. Based on the improved $0.5~\mu \text{m}$ CMOS process with four-layer stack capacitor, an IRFPA ROIC with $640\times 512$ array has been implemented and the dynamic range is improved from 73db to 78dB.

Keywords