Sustainable Bioinspired Helical Fibrous Electronics with Interfacial Bonding, Wide Range Elasticity and High Conductivity

Abstract

Abstract Because of the weak interfacial bonding between the substrates and active materials, most stretchable electronics often face the problem of performance destabilization and functional failure, especially under large strains. Herein, a super‐elastic, high conductive and core‐shell nanofibrous helix based on polyurethane (PU), silk fibroin (SF) and liquid metal (LM) is fabricated. Compared with traditional membrane, that the LM@PU/SF fibrous helix shows a wider range of workable strain (1500%) and reversible elasticity (600%) accompany with high conductivity is found. SF is acted as “glue” to strengthen the interfacial bonding between the PU and LM. The good elasticity of the helical structure and PU polymer as well as the fluidity of LM improve the stretchability, reversible elasticity and conductivity of the fibrous helix conductor. Furthermore, an alarming and monitoring apparatus using LM@PU/SF helix as the conductive unit based on multiscale fracture is engineered. This composite nanofibrous helix with ultra‐high conductivity and elasticity, making it a promising candidate for stretchable electronic devices.

Keywords

• bioinspired
• interfacial bonding
• multiscale fracture
• stretchable electronics
• sustainable helical fiber