Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications

Haibin Tang; Xingzhi Xiao

doi:10.3390/ma16175975

Materials (Aug 2023)

Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications

Haibin Tang,
Xingzhi Xiao

Affiliations

Haibin Tang: School of Intelligent Manufacturing, Nanjing University of Science and Technology, Nanjing 210094, China
Xingzhi Xiao: School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China

DOI: https://doi.org/10.3390/ma16175975
Journal volume & issue: Vol. 16, no. 17
p. 5975

Abstract

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The current Special Issue entitled “Advances in 3D printed electronics: materials, processes, properties and applications” aims to discuss the latest developments in the field of the AM of structures or components with reinforcements [...]

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Published in Materials

ISSN: 1996-1944 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering; Technology: Engineering (General). Civil engineering (General); Science: Natural history (General): Microscopy; Science: Physics: Descriptive and experimental mechanics
Website: http://www.mdpi.com/journal/materials/

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Abstract

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