Effect of the Number of Dips on the Properties of Copper Oxide Thin Films Deposited by Sol-Gel Dip- Coating Technique

Abstract

Copper oxide thin layers were elaborated using the sol-gel dip-coating. The thickness effect on morphological, structural, optical and electrical properties was studied. Copper chloride dihydrate was used as precursor and dissolved into methanol. The scanning electron microscopy analysis results showed that there is continuity in formation of the clusters and the nuclei with the increase of number of the dips. X-ray diffractogram showed that all the films are polycrystalline cupric oxide CuO phase with monoclinic structure with grain size in the range of 30.72 - 26.58 nm. The obtained films are clear blackin appearance, which are confirmed by the optical transmittance spectra. The optical band gap energies of the deposited films vary from 3.80 to 3.70 eV. The electrical conductivity of the films decreases from 1.90.10-2 to 7.39.10-3 (Ω.cm)-1

Keywords

• copper oxide
• thickness
• dip coating
• morphology
• structural
• optical
• and electrical properties.