Preparation of Low Volatile Organic Compounds Silver Paste Containing Ternary Conductive Fillers and Optimization of Their Performances

Abstract

Conductive silver paste is a key material in the fields of printed circuits and printed electronic devices. However, the preparation of conductive silver paste with low-cost and volatile organic compounds (VOCs) is still a challenge. In this work, conductive silver pastes with excellent comprehensive performances were developed by using water-borne polyurethane (WPU) as the bonding phase and using the ternary mixture of Ag microflakes (Ag MFs), Ag nanowires (Ag NWs), and Ag nanoparticles (Ag NPs) as the conductive phase. WPU endowed conductive silver pastes with the adhesion along with releasing a few VOCs during the curing. Results showed that a small amount of Ag NPs or Ag NWs dramatically enhanced the electrical conductivity of silver paste paint film filled only with Ag MFs. The electrical resistivity for optimal ternary mixture conductive silver paste was 0.2 × 10−3 Ω∙cm, and the conductive phase was composed of 20.0 wt% Ag MFs, 7.5 wt% Ag NWs, and 2.5 wt% Ag NPs. Meanwhile, the adhesive strength and hardness of silver paste paint film were effectively improved by increasing the curing temperature. The optimal overall performance of the conductive silver pastes was achieved at the curing temperature of 160 °C. Therefore, this work can provide a new route for preparing conductive silver pastes with high performances.

Keywords

• conductive silver paste
• Ag microflakes
• Ag nanoparticles
• Ag nanowires
• ternary fillers