Power Reduction in Punch-Through Current-Based Electro-Thermal Annealing in Gate-All-Around FETs

Abstract

Device guidelines for reducing power with punch-through current annealing in gate-all-around (GAA) FETs were investigated based on three-dimensional (3D) simulations. We studied and compared how different geometric dimensions and materials of GAA FETs impact heat management when down-scaling. In order to maximize power efficiency during electro-thermal annealing (ETA), applying gate module engineering was more suitable than engineering the isolation or source drain modules.

Keywords

• annealing
• dielectric
• gate-all-around (GAA)
• hot-carrier injection (HCI)
• power consumption
• punch-through