International Journal of Advances in Applied Mathematics and Mechanics (Sep 2019)

Residual stress analysis with various thicknesses of Copper films by XRD

Halo Dalshad Omar

Affiliations

Halo Dalshad Omar

Journal volume & issue: Vol. 7, no. 1
pp. 58 – 61

Abstract

No abstracts available.

Published in International Journal of Advances in Applied Mathematics and Mechanics

ISSN: 2347-2529 (Online)
Publisher: International Journal of Advances in Applied Mathematics and Mechanics
Country of publisher: India
LCC subjects: Science: Physics: Descriptive and experimental mechanics; Science: Mathematics
Website: http://www.ijaamm.com/

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