Research on ultrasonic vibration grinding technology of SiCp/Al composites

Abstract

In view of the difficulties in processing SiCp/Al materials by traditional grinding methods, the rapid wear of grinding tools, and the difficulties in obtaining high surface quality after processing, the ultrasonic vibration grinding method can significantly improve the processing effect. By analyzing the ultrasonic vibration trajectory of a single abrasive particle, it is concluded that its movement trajectory is a space ellipse shape, which can realize intermittent contact processing between the abrasive particle and the workpiece. The ultrasonic vibration grinding test is carried out on the SiCp/Al material with a volume fraction of 40% by using a resin-bonded diamond grinding head. Under different spindle speeds n, feed rates v, grinding depths ap and abrasive particle sizes d, the single-factor test method is used to detecte surface roughness of the workpiece. How each process parameter influences the Sa value of the workpiece surface roughness is obtained. And it is verified that ultrasonic vibration grinding of SiCp/Al can effectively improve the surface quality. The surface roughness of workpiece after ultrasonic vibration grinding decreases to 45 nm compared with 79 nm after ordinary grinding. The surface roughness of the workpiece first decreases and then increases with the increase of n, and it is the smallest when the speed is 1 800 r/min. The surface roughness of the workpiece increases with the increase of v and ap, and decreases with the decrease of d. And the optimal parameter combination in the test parameters is obtained: n=1 800 r/min, v=5 mm/min, ap=1 μm, d=4.5 μm.

Keywords

• sicp/al composite
• diamond grinding head
• ultrasonic vibration grinding
• surface roughness