Oblique microchannel merged with circle micro pin-fin as a novel hybrid heat sink for cooling of electronic devices

Abstract

Recently, the advantages of microchannel and micro pin-fin heat sinks for cooling have become clear. This study delves into the effects of hybrid designs on electronic chip cooling by combining microchannel and pin-fin patterns. The research contrasts the performance of a straight microchannel heat sink (Case Ⅰ), circular pin-fin (Case Ⅱ), straight-circular pin-fin-straight (Case Ⅲ), and oblique grooved straight-circular pin-fin-oblique grooved straight (Case Ⅳ). Results show that Case Ⅳ's Nu number reaches 61 at Re = 1250, surpassing Case Ⅰ, Case Ⅱ, and Case Ⅲ by 517 %, 32 %, and 235 %, respectively. Case Ⅳ also has the highest pressure drop. The study calculates each Case's performance evaluation index (ƞ), highlighting the balance between enhanced Nu numbers and pressure drops. Case Ⅳ's ƞ is notably higher than Case Ⅱ and Case Ⅲ. To achieve a more uniform thermal distribution across the entire heat sink, the orientation of the oblique grooves is modified in Case Ⅳ, resulting in a new design labeled Case Ⅴ. While Cases Ⅳ and Ⅴ have similar Nusselt numbers, Case Ⅴ's design ensures consistent temperature distribution, reducing hotspot risks on the chip.

Keywords

• Microchannel heat sink
• Hybrid pattern
• Heat transfer
• Performance evaluation criteria
• Electronic cooling
• Hotspot creation