Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO(2) nanowires (SiC@SiO(2) NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO(2) NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO(2) NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m^−1 K^−1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO(2) NWs composites could be the ideal candidate for TIM.
