Development of Crack Detection Method with 2 Dimensionally Generated 3 Dimensionally Reconstructed Images in THT Solder Joints

Abstract

This work represents an interesting development in the detection and interpretation of crack evolution in through hole technology (THT) solder joints, which based on the development of general and common method. Serial sectioning is a useful method because it overcomes the problems associated with traditional two-dimensional metallographic techniques by providing information about (micro)structures in three-dimensions.

Keywords

• serial sectioning
• reconstruction
• total crack length (TCL)
• through hole technology (THT)