Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy

Tianhan Hu; Shun Li; Zhen Li; Guanzhi Wu; Ping Zhu; Wufeng Dong; Yu Sun; Jiayi Zhou; Bingjia Wu; Bingge Zhao; Kai Ding; Yulai Gao

Journal of Materials Research and Technology (Sep 2023)

Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy

Tianhan Hu,
Shun Li,
Zhen Li,
Guanzhi Wu,
Ping Zhu,
Wufeng Dong,
Yu Sun,
Jiayi Zhou,
Bingjia Wu,
Bingge Zhao,
Kai Ding,
Yulai Gao

Affiliations

Tianhan Hu: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Shun Li: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Zhen Li: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Guanzhi Wu: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Ping Zhu: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Wufeng Dong: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Yu Sun: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Jiayi Zhou: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Bingjia Wu: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Bingge Zhao: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China
Kai Ding: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China; Corresponding author.
Yulai Gao: State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China; Shanghai Engineering Research Center for Metal Parts Green Remanufacture, Shanghai 200444, PR China; Corresponding author. State Key Laboratory of Advanced Special Steel, Center for Advanced Solidification Technology, School of Materials Science and Engineering, Shanghai University, Shanghai 200444, PR China.

Journal volume & issue: Vol. 26
pp. 5902 – 5909

Abstract

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The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with negligible loss of the plasticity. Especially, the Sn–Bi solder alloy with 0.4 wt. % Ag and 1.5 wt. % In exhibits the maximum tensile strength and elongation of 79.7 MPa and 45.9%, respectively. The microstructure of the Sn–Bi solder alloys is mainly composed of Bi-rich and β-Sn phases. With the addition of elements Ag and In, the microstructure is significantly refined, and the lamellar eutectic structure with thinner interlayer spacing could be detected. Element Ag tends to form Ag3Sn phase while element In solutes in the Sn matrix. The mechanical properties of the as-prepared Sn–Bi solder alloy are improved attributed to the precipitated-phase strengthening of the fined Ag3Sn phase and the refinement effect of In on coarse Bi-rich phase.

Published in Journal of Materials Research and Technology

ISSN: 2238-7854 (Print); 2214-0697 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Technology: Mining engineering. Metallurgy
Website: https://www.journals.elsevier.com/journal-of-materials-research-and-technology/

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