The effect of bi presence as impurities in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper

Abstract

The influence of Bi, as foreign metal atoms in anode copper, on kinetics and mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate solution was investigated using the galvanostatic single-pulse method. Results indicate that presence of Bi atoms in anode copper increases the exchange current density, as determined from the Tafel analysis of the electrode reaction, which is attributed to the increase of the crystal lattice parameter determined from XRD analysis of the electrode material.

Keywords

• copper
• anodic dissolution
• cathodic deposition