ITM Web of Conferences (Jan 2019)

Analysis and optimization of ultrasonic copper wires using fuzzy logic approach

  • Zawadzki Jacek,
  • Jędryczka Cezary

DOI
https://doi.org/10.1051/itmconf/20192801019
Journal volume & issue
Vol. 28
p. 01019

Abstract

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Ultrasonic welding has been used in the market over the past thirty years and offer to the manufacturing industries like automotive, aviation, medical and many more due to various hurdles faced by conventional fusion welding or crimp processes. Very short time (less than 1 second) and no additional material during the connection process are very key advantages. Due to this fact this technology can be used for mass production. Plenty of times, the problems faced by industry due to this process are the poor weld quality and strength of the joints surface. In presented study, the process parameters like vibration amplitude, weld pressure and weld time are considered in analysis of the welding of copper wires (Cu- ETP1). Experiment is conducted according to the fractional design with replications to get the responses like tensile shear stress and T-peel stress of the weld. Measured data are utilized next to develop fuzzy logic model between responses and predictors. As a quality is an very important issue in these manufacturing industries, the optimal combinations of studied process parameters are found using fuzzy logic approach.