Transient Heat Transfer Characteristics in a Flat Plate Heat Sink with Mini-Channels for Cooling High Heat Flux IGBT

Abstract

Effective cooling of a high heat flux IGBT electronic system is highly related to system efficiency and safety. A flat plate heat sink was designed to experimentally investigate the transient heat transfer characteristics of IGBT cooling. It is made of aluminum with 20 mini-channels of 249 mm × 3 mm × 4 mm dimensions, which were manufactured by milling machines and melt inert gas (MIG) welding technology to ensure no deformation. Experiments were conducted using deionized water at atmospheric pressure with flow rates of 3.2–9.5 L/min and heat fluxes of 104–347 W/cm2. It was found that instantaneous start-stop and transient heating power variation might cause IGBT failure, especially under low Reynolds and Nusselt number conditions. The temperature rise rate and cooling rate vary with different system parameters. Heating rate can be reduced by high flow rate due to local subcooled boiling. The concept of respond time (RT) based on the piecewise function is suggested to evaluate the influence of transient condition on heating rate. Analysis of flow fluctuation indicated that it would not be a threat to the system except for in extreme cases. These findings provide a reference for the considerations of the design and manufacture of IGBT cooling flat plate heat sinks with mini-channels.

Keywords

• transient heat transfer
• mini-channel
• flat plate heat sink
• high heat flux
• IGBT