Numerical Simulation of Solvent Evaporation in a Reactive Silver Ink Droplet Deposited on a Heated Substrate

• Weipeng Zhang,
• Jun Yang,
• George K. Knopf

Affiliations

Weipeng Zhang

Mechanical and Materials Engineering, The University of Western Ontario, London, Ontario, Canada

Jun Yang

Mechanical and Materials Engineering, The University of Western Ontario, London, Ontario, Canada

George K. Knopf

Mechanical and Materials Engineering, The University of Western Ontario, London, Ontario, Canada