2.5D package interposer automatic design based on Allegro Package Design

Abstract

Due to the high bandwidth characteristics of HBM(high bandwidth memory), there are a large number of HBM interface connections that need to be manually completed during the layout design of the 2.5D package interposer. This article describes how to use the SKILL language to implement automatic wiring of HBM interface in APD(Allegro package design), reducing the original manual wiring from 2 weeks to 10 minutes, saving design cycles.

Keywords

• 2.5d advanced package
• hbm(high bandwidth memory)
• skill
• apd(allegro package design)
• automatic wiring