Biochemical Behavior, Influence on Cell DNA Condition, and Microbiological Properties of Wool and Wool–Copper Materials

Abstract

The paper presents the study concerning the preparation and physio-chemical and biological properties of wool–copper (WO-Cu) materials obtained by the sputter deposition of copper onto the wool fibers. The WO-Cu material was subjected to physio-chemical and biological investigations. The physio-chemical investigations included the elemental analysis of materials (C, N, O, S, and Cu), their microscopic analysis, and surface properties analysis (specific surface area and total pore volume). The biological investigations consisted of the antimicrobial activity tests of the WO-Cu materials against colonies of Gram-positive (Staphylococcus aureus) bacteria, Gram-negative (Escherichia coli) bacteria, and fungal mold species (Chaetomium globosum). Biochemical–hematological tests included the evaluation of the activated partial thromboplastin time and pro-thrombin time. The tested wool–copper demonstrated the ability to interact with the DNA in a time-dependent manner. These interactions led to the DNA’s breaking and degradation. The antimicrobial and antifungal activities of the WO-Cu materials suggest a potential application as an antibacterial/antifungal material. Wool–copper materials may be also used as customized materials where the blood coagulation process could be well controlled through the appropriate copper content.

Keywords

• antifungal activity
• antimicrobial activity
• blood coagulation
• DNA damage
• activated partial thromboplastin time
• magnetron sputtering