Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition

Dawei Wang; Wensheng Zhao

doi:10.3390/mi15050643

Micromachines (May 2024)

Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition

Dawei Wang,
Wensheng Zhao

Affiliations

Dawei Wang: School of Electronics and Information and School of Integrated Circuit Science and Engineering, Hangzhou Dianzi University, Hangzhou 310018, China
Wensheng Zhao: School of Electronics and Information and School of Integrated Circuit Science and Engineering, Hangzhou Dianzi University, Hangzhou 310018, China

DOI: https://doi.org/10.3390/mi15050643
Journal volume & issue: Vol. 15, no. 5
p. 643

Abstract

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Interconnect and packaging technologies are crucial aspects of modern electronics, and they are essential to achieve high performance, miniaturization and low power consumption of electronic equipment [...]

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Published in Micromachines

ISSN: 2072-666X (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Mechanical engineering and machinery
Website: https://www.mdpi.com/journal/micromachines

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