Electrochemical activities of Ni-Ti alloy in artificial blood plasma with Trigonella foenum graecum seeds

Abstract

An investigation of the electrochemical behaviour of Ni-Ti alloy when exposed to artificial blood plasma (ABP) in the presence of 0.1 and 0.5 ppm of Trigonella foenum graecum (TFG) seeds for 1, 10, 20, and 30 days. Studies on AC impedance and polarisation have shown that a protective coating forms on the metal surface while inhibiting corrosion. The protective film has formed on the Ni-Ti implant alloy surface, the linear polarization resistance increased (LPR), and the corrosion current value (Icorr) decreased. The charge transfer resistant value (Rct) and impedance value increase and the double-layer capacitance value decrease.The protective layers morphology and the elemental composition were analyzed by SEM/EDAX. The property of the protective film on the Ni-Ti alloy has been examined by atomic force microscope. The X-ray diffraction analysis has confirmed the nature of the apatite. The corrosion inhibition efficiency of Ni-Ti alloy in ABP in the presence of TFG seeds at various concentrations for different times was improved and protected.

Keywords

• nickel-titanium, afm, protective film, nyquist plots, bode plots