Fabrication and Characterization of Thin Metal Films Deposited by Electroless Plating with Organic Additives for Electrical Circuits Applications
Nikita S. Buylov,
Nadezhda V. Sotskaya,
Oleg A. Kozaderov,
Khidmet S. Shikhaliev,
Andrey Yu. Potapov,
Vladimir A. Polikarchuk,
Sergey V. Rodivilov,
Vitaly V. Pobedinskiy,
Margaryta V. Grechkina,
Pavel V. Seredin
Affiliations
Nikita S. Buylov
Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
Nadezhda V. Sotskaya
Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
Oleg A. Kozaderov
Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
Khidmet S. Shikhaliev
Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
Andrey Yu. Potapov
Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
Vladimir A. Polikarchuk
Laboratory of Organic Additives for the Processes of Chemical and Electrochemical Deposition of Metals and Alloys Used in the Electronics Industry, Voronezh State University, University sq. 1, Voronezh 394018, Russia
Sergey V. Rodivilov
Research Institute of Electronic Technology, St. Staryh Bolshevikov, 5, Voronezh 394033, Russia
Vitaly V. Pobedinskiy
Research Institute of Electronic Technology, St. Staryh Bolshevikov, 5, Voronezh 394033, Russia
Margaryta V. Grechkina
Department of Semiconductor and Microelectronics Physics, Voronezh State University, University sq. 1, Voronezh 394018, Russia
Pavel V. Seredin
Department of Solid-State Physics and Nanostructures, Voronezh State University, University sq. 1, Voronezh 394018, Russia
In our work, we studied thin nickel films deposited by electroless plating for use as a barrier and seed layer in the through-silicon vias (TSV) technology. El-Ni coatings were deposited on a copper substrate from the original electrolyte and with the use of various concentrations of organic additives in the composition of the electrolyte. The surface morphology, crystal state, and phase composition of the deposited coatings were studied by SEM, AFM, and XRD methods. The El-Ni coating deposited without the use of an organic additive has an irregular topography with rare phenocrysts of globular formations of hemispherical shape and a root mean square roughness value of 13.62 nm. The phosphorus concentration in the coating is 9.78 wt.%. According to the results of the X-ray diffraction studies of El-Ni, the coating deposited without the use of an organic additive has a nanocrystalline structure with an average nickel crystallite size of 2.76 nm. The influence of the organic additive is seen in the smoothening of the samples surface. The root mean square roughness values of the El-Ni sample coatings vary within 2.09–2.70 nm. According to microanalysis data the phosphorus concentration in the developed coatings is ~4.7–6.2 wt.%. The study of the crystalline state of the deposited coatings by X-ray diffraction made it possible to detect two arrays of nanocrystallites in their structure, with average sizes of 4.8–10.3 nm and 1.3–2.6 nm.
