3D-Printed Carbon-Based Conformal Electromagnetic Interference Shielding Module for Integrated Electronics

Shaohong Shi; Yuheng Jiang; Hao Ren; Siwen Deng; Jianping Sun; Fangchao Cheng; Jingjing Jing; Yinghong Chen

doi:10.1007/s40820-023-01317-w

Nano-Micro Letters (Jan 2024)

3D-Printed Carbon-Based Conformal Electromagnetic Interference Shielding Module for Integrated Electronics

Shaohong Shi,
Yuheng Jiang,
Hao Ren,
Siwen Deng,
Jianping Sun,
Fangchao Cheng,
Jingjing Jing,
Yinghong Chen

Affiliations

Shaohong Shi: State Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University
Yuheng Jiang: State Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University
Hao Ren: State Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University
Siwen Deng: State Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University
Jianping Sun: State Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University
Fangchao Cheng: State Key Laboratory of Featured Metal Materials and Life-Cycle Safety for Composite Structures, School of Resources, Environment and Materials, Guangxi University
Jingjing Jing: State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan University
Yinghong Chen: State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Sichuan University

DOI: https://doi.org/10.1007/s40820-023-01317-w
Journal volume & issue: Vol. 16, no. 1
pp. 1 – 15

Abstract

Read online

Highlights 3D printable functional inks incorporated with graphene and carbon nanotube nanoparticles were well-formulated by manipulating their rheological performance The frame with ultralight structure (0.076 g cm−3) and high-efficiency electromagnetic interference shielding (61.4 dB) was assembled 3D-printed c-SE module was in situ integrated onto the electronics, affording multiple functions of electromagnetic compatibility and thermal dissipation.

Published in Nano-Micro Letters

ISSN: 2311-6706 (Print); 2150-5551 (Online)
Publisher: SpringerOpen
Country of publisher: Germany
LCC subjects: Technology
Website: http://www.springer.com/40820

About the journal

Abstract

Keywords