Digital Holographic Study of pH Effects on Anodic Dissolution of Copper in Aqueous Chloride Electrolytes
Changqi Yan,
Boyu Yuan,
Zhenhui Li,
Liang Li,
Chao Wang
Affiliations
Changqi Yan
Jiangsu Key Laboratory of Green Synthetic Chemistry for Functional Materials, School of Chemistry & Material Science, Jiangsu Normal University, Xuzhou 221116, China
Boyu Yuan
Jiangsu Key Laboratory of Advanced Laser Materials and Devices, School of Physics and Electronic Engineering, Jiangsu Normal University, Xuzhou 221116, China
Zhenhui Li
Jiangsu Key Laboratory of Advanced Laser Materials and Devices, School of Physics and Electronic Engineering, Jiangsu Normal University, Xuzhou 221116, China
Liang Li
Jiangsu Key Laboratory of Green Synthetic Chemistry for Functional Materials, School of Chemistry & Material Science, Jiangsu Normal University, Xuzhou 221116, China
Chao Wang
Jiangsu Key Laboratory of Green Synthetic Chemistry for Functional Materials, School of Chemistry & Material Science, Jiangsu Normal University, Xuzhou 221116, China
The anodic dissolution of copper in chloride electrolytes with different pH has been investigated by using polarization measurements and digital holography. In acidic and neutral NaCl solutions, the oxidation processes of copper are almost the same: copper firstly dissolves as cuprous ions, which then produces the CuCl salt layer. The dissolution rate in the acidic solution is a little higher than that in the neutral. However, the mechanism is quite different in the alkaline NaCl solution: copper turns passive easily due to the formation of a relatively stable Cu2O film which results in pitting, and the dissolution rate of copper decreases before pit initiation.
