THE RATE OF CONTACT MELTING AND PHASE TRANSFORMATION IN THE PAIR COPPER / ALUMINUM OF AMG-2 BRAND SYSTEM

Abstract

Studying of the contact melting (CM) in / Cu Al system plays an important role for the development of technology of the contact – reactive soldering. Also the data on CM can be of interest at design of layered intermetallic composite material of the system Cu-Al, by development of heat-dissipating devices, powerful high-frequency diodes and transistors. In the present work an attempt is made to reveal features of the structure of contact layers at contact melting of copper with aluminum of the AMG-2 brand (addition of Mg ~ 2 wet. %, the rest aluminum) and to fix influence of Mg impurity on the time dependence of the thickness of a contact layer for system Cu/Al.

Keywords

• contact melting
• intermetallics
• phase formation
• impurity