Effect of Mat Moisture Content, Adhesive Amount and Press Time on the Performance of Particleboards Bonded with Fructose-Based Adhesives
Catherine Rosenfeld,
Pia Solt-Rindler,
Wilfried Sailer-Kronlachner,
Thomas Kuncinger,
Johannes Konnerth,
Andreas Geyer,
Hendrikus W. G. van Herwijnen
Affiliations
Catherine Rosenfeld
Wood K Plus-Competence Center of Wood Composites and Wood Chemistry, Kompetenzzentrum Holz GmbH, Altenberger Str. 69, A-4040 Linz, Austria
Pia Solt-Rindler
Wood K Plus-Competence Center of Wood Composites and Wood Chemistry, Kompetenzzentrum Holz GmbH, Altenberger Str. 69, A-4040 Linz, Austria
Wilfried Sailer-Kronlachner
Wood K Plus-Competence Center of Wood Composites and Wood Chemistry, Kompetenzzentrum Holz GmbH, Altenberger Str. 69, A-4040 Linz, Austria
Thomas Kuncinger
Fritz EGGER GmbH & Co.OG., A-3105 St. Pölten, Austria
Johannes Konnerth
Institute of Wood Technology and Renewable Materials, Department of Material Science and Process Engineering, University of Natural Resources and Life Sciences Vienna, Konrad-Lorenz Str. 24, A-3430 Tulln, Austria
Andreas Geyer
Fritz EGGER GmbH & Co.OG., A-3105 St. Pölten, Austria
Hendrikus W. G. van Herwijnen
Wood K Plus-Competence Center of Wood Composites and Wood Chemistry, Kompetenzzentrum Holz GmbH, Altenberger Str. 69, A-4040 Linz, Austria
The study evaluates the performance of laboratory, single-layered particleboards made out of fructose-hydroxymethylfurfural-bishexamethylenetriamine (SusB) adhesive as a sustainable alternative. Several production parameters such as mat moisture content (MMC), adhesive amount and press time were varied and their effect on the bonding efficiency investigated. The internal bond strength (IB) and thickness swelling after 24 h of water immersion (TS) were taken as evaluation criteria for the bonding efficiency. pMDI-bonded particleboards were produced as fossil-based, formaldehyde-free reference. Particleboard testing was complemented by tensile shear strength measurements and thermal analysis. It was found that the MMC has the highest impact on the internal bond strength of SusB-bonded particleboards. In the presence of water, the reaction enthalpy of the main curing reaction (occurring at 117.7 °C) drops from 371.9 J/mol to 270.5 J/mol, leading to side reactions. By reducing the MMC from 8.7%, the IB increases to 0.61 N/mm2, thus surpassing P2 requirements of the European standard EN312. At a press factor of 10 s/mm, SusB-bonded particleboards have a similar IB strength as pMDI-bonded ones, with 0.59 ± 0.12 N/mm2 compared to 0.59 ± 0.09 N/mm2. Further research on the improvement of the dimensional stabilization of SusB-bonded PBs is needed, as the TS ranges from 30–40%.
