Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices

Abstract

This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly.

Keywords

• MEMS
• wafer level thin film package
• packaging
• resonator