Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal

SHI Lei; CUI Liang; ZHOU Fei; GU Xiao-long; HE Peng

doi:10.11868/j.issn.1001-4381.2016.10.008

Cailiao gongcheng (Oct 2016)

Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal

SHI Lei,
CUI Liang,
ZHOU Fei,
GU Xiao-long,
HE Peng

Affiliations

SHI Lei: Zhejiang Provincial Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310007, China
CUI Liang: Zhejiang Provincial Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310007, China
ZHOU Fei: Zhejiang Provincial Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310007, China
GU Xiao-long: Zhejiang Provincial Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310007, China
HE Peng: State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

DOI: https://doi.org/10.11868/j.issn.1001-4381.2016.10.008
Journal volume & issue: Vol. 44, no. 10
pp. 54 – 59

Abstract

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Influence of Sn on microstructure, melting characteristic and brazing performance of electric vacuum Ag-Cu filler metal was studied by using scanning electronic microscope (SEM) with energy disperse spectroscopy (EDS), differential scanning calorimetry (DSC) and contrast tests. The results show that, while the addition of Sn is 4% (mass fraction,the same below), there is no brittle β-Cu phase in Ag60Cu filler metal,the effect on the processing performance is not obvious; with the increase of Sn content, the liquidus temperature of Ag60Cu filler metal decreases gradually, but the solidus temperature drops drastically,resulting in wider melting temperature range, and worse gap filling ability of filler metal. The Ag60Cu filler metal with Sn content of 4% has good spreading and metallurgical bonding abilities on copper plates, which are closer to that of BAg72Cu filler metal, and it can be processed into flake filler metal to replace the BAg72Cu flake filler metal to be used.

Published in Cailiao gongcheng

ISSN: 1001-4381 (Print)
Publisher: Journal of Materials Engineering
Country of publisher: China
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: http://jme.biam.ac.cn/CN/1001-4381/home.shtml

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