In Situ Investigation of Microstructural Evolution and Intermetallic Compounds Formation at Liquid Al/Solid Cu Interface by Synchrotron X-ray Radiography
Fei Cao,
Ruosi Wang,
Peng Zhang,
Tongmin Wang,
Kexing Song
Affiliations
Fei Cao
Shaanxi Province Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China
Ruosi Wang
Shaanxi Province Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China
Peng Zhang
Shaanxi Province Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China
Tongmin Wang
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Kexing Song
School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China
Synchrotron radiation dynamic imaging technology combined with the static characterization method was used to study the microstructural evolution and the growth kinetics of intermetallic compounds (IMCs) at the liquid Al/solid Cu interface. The results show that the interfacial microstructure can be divided into layered solid diffusion microstructures (AlCu3, Al4Cu9, Al2Cu3 and AlCu) and solidification microstructures (Al3Cu4, AlCu and Al2Cu) from the Cu side to the Al side. Meanwhile, the growth of bubbles formed during the melting, holding and solidification of an Al/Cu sample was also discussed, which can be divided into three modes: diffusion, coalescence and engulfment. Moreover, the growth of AlCu3 and (Al4Cu9 + Al2Cu3) near the Cu side is all controlled by both interfacial reaction and volume diffusion. The growth of Al3Cu4 adjacent to the melt is mainly controlled by the interfacial reaction, which plays a major role in the growth of the total IMCs.
