A novel bandgap voltage reference based on folding compensation

Mingyu Liu; Haoyu Zhuang; Liangchen Huang; Linzhi Tao; Qiang Li

doi:10.1049/ell2.12791

Electronics Letters (Apr 2023)

A novel bandgap voltage reference based on folding compensation

Mingyu Liu,
Haoyu Zhuang,
Liangchen Huang,
Linzhi Tao,
Qiang Li

Affiliations

Mingyu Liu: School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China Chengdu Sichuan China
Haoyu Zhuang: School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China Chengdu Sichuan China
Liangchen Huang: School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China Chengdu Sichuan China
Linzhi Tao: School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China Chengdu Sichuan China
Qiang Li: School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China Chengdu Sichuan China

DOI: https://doi.org/10.1049/ell2.12791
Journal volume & issue: Vol. 59, no. 8
pp. n/a – n/a

Abstract

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Abstract This letter proposes a novel bandgap reference circuit that utilizes both curvature and folding compensation to achieve a temperature coefficient (TC) of 2.23 ppm/°C. Unlike traditional BGRs, the unique folding compensation method of this circuit improves the performance at low temperature and can also be applied within a specific temperature range.

Published in Electronics Letters

ISSN: 0013-5194 (Print); 1350-911X (Online)
Publisher: Wiley
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering
Website: https://ietresearch.onlinelibrary.wiley.com/journal/1350911X

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