Thermal cooling enhancement of dual processors computer with thermoelectric air cooler module

Abstract

The thermal cooling enhancement technique of dual processors workstation computer couple thermoelectric air cooler module is studied experimentally. The monitored parameters mainly focus on the computer load conditions, with and without thermoelectric air cooler module, cooling fan turns on/off modes, and different cooling fan sizes. In experiment process, the working computer load of 0–100% is performed. The temperature distribution inside the computer chassis depends on the density, position of the components inside the computer both active and passive components. It is found that the thermoelectric air cooler module has a significant effect on the air and the CPU temperatures of the dual processor computer. In addition, the operating modes, positions and sizes of the cooling fan have significant effect on air distribution inside the computer chassis. However, energy consumption is also increased. The results of this study are expected to lead to guidelines that will allow the design of the cooling system with improved heat transfer performance of the electronic equipment. Keywords: Thermal cooling, Thermoelectric air cooler module, Dual processor computer