Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devices

Dong Ye; Zihan Peng; Jinxu Liu; YongAn Huang

Materials & Design (Nov 2022)

Self-Limited ultraviolet laser sintering of liquid metal particles for μm-Thick flexible electronics devices

Dong Ye,
Zihan Peng,
Jinxu Liu,
YongAn Huang

Affiliations

Dong Ye: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China; Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China; Corresponding authors at: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China.
Zihan Peng: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China; Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China
Jinxu Liu: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China; Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China
YongAn Huang: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China; Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan 430074, China; Corresponding authors at: State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China.

Journal volume & issue: Vol. 223
p. 111189

Abstract

Read online

Lightweight, deformable and highly conductive conductors are rather appealing in flexible electronics devices such as electromagnetic interference (EMI) shielding films; however, the most commonly used metallic foils or carbon nanomaterials suffer from critical limitation of either film thickness or electrical conductivity. Herein, we present a facile approach to rapidly fabricate sintered liquid metal submicron particles (LMSPs) films in combination spray-coating with direct nanosecond ultraviolet (UV) laser sintering. High conductive, μm-thick sintered LMSPs films were prepared owing to the self-limited penetration depth of UV laser, and their sheet resistances are easily tuned at least seven orders of magnitude by the laser processing parameters. A calculated parametric map upon particle diameter and laser fluence whether or not a liquid metal particle is ruptured has been obtained and it is quite well in accordance to the experiment results. Such laser-sintered LMSPs films are finally utilized to fabricate shielding films with superior EMI shielding effectiveness (SE) of ∼33 dB and specific EMI SE over thickness (SSE/t) of ∼27500 dB•cm2•g−1, and flexible electromagnetic metamaterials with a high absorption above 99.9 % at resonance frequency of 12.9 GHz and 14.3 GHz, showing their high potential for flexible EMI shielding and electromagnetic wave absorption applications.

Published in Materials & Design

ISSN: 0264-1275 (Print); 1873-4197 (Online)
Publisher: Elsevier
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: https://www.journals.elsevier.com/materials-and-design

About the journal

Abstract

Keywords