Ultrasonic Nondestructive Evaluation of Composite Bond Strength: Quantification through Bond Quality Index (BQI)

Abstract

This article presents a concept, materials, and methods to devise a Bond Quality Index (BQI) for assessing composite bond quality, approximately correlating to the respective bond strength. Interface bonding is the common mechanism to join two composite structural components. Ensuring the health and quality of the bond line between two load-bearing composite structures is crucial. The article presents the classification and data-driven distinction between two types of bond lines between similar structural components. The interface bonds in composite plates were prepared using polyester peel ply and TX-1040 nylon peel ply. For all the plates, ultrasonic inspection through scanning acoustic microscopy (SAM) (>10 MHz) was performed before and after localized failure of the plate by impinging energy. Energy was impinged 0–10 J/cm2 of in the 16-ply plates, and 0–25 J/cm2 were impinged in 40-ply plates. Followed by bond failure and SAM, a new parameter called the Bond Quality Index (BQI) was formulated using ultrasonic scan data and energy data. The BQI was found to be 0.55 and 0.45, respectively, in plates with polyester peel ply and TX-1040 nylon peel ply bonds. Further, in 40-ply plates with polyester peel ply resulted in a BQI equivalent to 3.49 compared to 0.75 in plates with a TX-1040 nylon peel ply bond. Currently, the BQI is not normalized; however, this study could be used for AI-driven normalized BQIs for all types of bonds in the future.

Keywords

• adhesive bonding
• NDE
• nondestructive evaluation
• ultrasonic NDE
• bond line NDE
• composite bond