Fabrication and Characterizations of PbZrxTi1-xO3 (PZT) Ultrasonic Sensing Chips

Ming-Ling Lee; Shih-Ming Chen; Jia-Jie Jhang; Lin-Sin Lu; Shu-Ting Yang; Pin-En Chiu; Yu-Sheng Tsai; Yewchung Sermon Wu; Chin-Chi Cheng; Hsiang Chen; Jung Han

doi:10.1109/ACCESS.2022.3158740

IEEE Access (Jan 2022)

Fabrication and Characterizations of PbZrxTi1-xO3 (PZT) Ultrasonic Sensing Chips

Ming-Ling Lee,
Shih-Ming Chen,
Jia-Jie Jhang,
Lin-Sin Lu,
Shu-Ting Yang,
Pin-En Chiu,
Yu-Sheng Tsai,
Yewchung Sermon Wu,
Chin-Chi Cheng,
Hsiang Chen,
Jung Han

Affiliations

Ming-Ling Lee: Department of Electro-Optical Engineering, Minghsin University of Science and Technology, Hsinchu, Taiwan
Shih-Ming Chen: Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Nantou, Taiwan
Jia-Jie Jhang: Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Nantou, Taiwan
Lin-Sin Lu: ORCiD; Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Nantou, Taiwan
Shu-Ting Yang: Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Nantou, Taiwan
Pin-En Chiu: Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Nantou, Taiwan
Yu-Sheng Tsai: Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
Yewchung Sermon Wu: Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
Chin-Chi Cheng: ORCiD; Department of Energy and Refrigerating Air Conditioning Engineering, National Taipei University of Technology, Taipei, Taiwan
Hsiang Chen: ORCiD; Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Nantou, Taiwan
Jung Han: Department of Electrical Engineering, Yale University, New Haven, CT, USA

DOI: https://doi.org/10.1109/ACCESS.2022.3158740
Journal volume & issue: Vol. 10
pp. 32453 – 32460

Abstract

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PbZrxTi1-xO3 (PZT) ultrasonic sensing chips were fabricated by ball milling, electrical discharge and spraying on iron sheets. Various PZT growth conditions, including the thickness of the iron sheet and the coating layers, were investigated. Ultrasonic sensing measurements indicated that PZT chips of sufficient thickness and with 6 or 9 coating layers exhibited ultrasonic sensing capability. Further, multiple material and electrical characterizations revealed that while sufficient thickness and low leakage were required, uniform growth of the film and a grain size of approximately 150 nm were preferable for ultrasonic sensing. Their compact size, rapid response, and low cost make PZT-based ultrasonic sensors promising for future ultrasonic detection application.

Published in IEEE Access

ISSN: 2169-3536 (Online)
Publisher: IEEE
Country of publisher: United States
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering
Website: https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6287639

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