Recent Advances in 850 nm VCSELs for High-Speed Interconnects

Hao-Tien Cheng; Yun-Cheng Yang; Te-Hua Liu; Chao-Hsin Wu

doi:10.3390/photonics9020107

Photonics (Feb 2022)

Recent Advances in 850 nm VCSELs for High-Speed Interconnects

Hao-Tien Cheng,
Yun-Cheng Yang,
Te-Hua Liu,
Chao-Hsin Wu

Affiliations

Hao-Tien Cheng: Graduate Institute of Electronics Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan
Yun-Cheng Yang: Graduate Institute of Photonics and Optoelectronics, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan
Te-Hua Liu: Graduate Institute of Photonics and Optoelectronics, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan
Chao-Hsin Wu: Graduate Institute of Electronics Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan

DOI: https://doi.org/10.3390/photonics9020107
Journal volume & issue: Vol. 9, no. 2
p. 107

Abstract

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Vertical-cavity surface-emitting lasers (VCSELs) have made remarkable progress, are being used across a wide range of consumer electronic applications, and have particularly received much attention from the telecom and datacom industries. However, several constraints are thus currently being tackled to improve the device characteristics and modulation formats to meet the various demanding requirements of the future 800 GbE and 1.6 TbE Ethernet standards. This manuscript discusses the device characteristics and the key considerations in the device designs and optimizations. Finally, we elucidate the latest developments and vital features of modern 850 nm VCSELs for high-speed interconnects.

Published in Photonics

ISSN: 2304-6732 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Engineering (General). Civil engineering (General): Applied optics. Photonics
Website: http://www.mdpi.com/journal/photonics

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