The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Abstract

In recent years, in order to adapt to the trend of low-temperature assembly and integration, low-temperature hybrid solders with multiple elements added to the tin solder matrix have been investigated. In this regard, the morphology and size of intermetallic compounds (IMCs) are altered by adding some alloying elements, and the strength of solder joints is improved to some extent. Different pad surface treatments affect the growth of IMC, which leads to various failure modes in interconnect solder joints. Therefore, it is necessary to study the interfacial reaction, microstructure and mechanical properties of hybrid solder and different metal pads to explore the growth mechanism of IMC and the failure modes of solder joints. In this paper, mixed Sn–3Ag-0.5Cu/Sn–58Bi low-temperature solder joints on Au/Ni/Cu (ENIG) and Au/Pd/Ni/Cu (ENEPIG) substrates are investigated. The results show that the addition of palladium element can change the IMC morphology, refine the grain size of the hybrid solder joints, and affect the fracture failure mode of the solder joints under shear force. The average shear strength is significantly higher than that of solder joints with ENIG surfaces under different process parameters. Thermodynamic calculations of enthalpy change and the effect of Jackson's parameter α value on IMC morphology are also investigated in this paper. The addition of palladium elements increases the α value and is more favorable to the formation of columnar grains. This provides guidance for the grain growth of IMC in hybrid solder joints with added alloying elements.

Keywords

• SAC305/Sn58Bi
• IMC morphology
• Au/Ni/Cu pad
• Au/Pd/Ni/Cu pad