Resolution-Enhancing Structure for the Electric Field Microsensor Chip
Xiaolong Wen,
Pengfei Yang,
Zhouwei Zhang,
Zhaozhi Chu,
Chunrong Peng,
Yutao Liu,
Shuang Wu,
Bo Zhang,
Fengjie Zheng
Affiliations
Xiaolong Wen
Beijing Engineering Research Center of Detection and Application for Weak Magnetic Field, Department of Physics, University of Science and Technology Beijing, Beijing 100083, China
Pengfei Yang
School of Applied Science, Beijing Information Science and Technology University, Beijing 100192, China
Zhouwei Zhang
State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China
Zhaozhi Chu
Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China
Chunrong Peng
State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China
Yutao Liu
Beijing Tflying Transducer Technology Co., Ltd., Beijing 100083, China
Shuang Wu
Beijing Tflying Transducer Technology Co., Ltd., Beijing 100083, China
Bo Zhang
Beijing Engineering Research Center of Detection and Application for Weak Magnetic Field, Department of Physics, University of Science and Technology Beijing, Beijing 100083, China
Fengjie Zheng
State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China
Electrostatic voltage is a vital parameter in industrial production lines, for reducing electrostatic discharge harms and improving yields. Due to such drawbacks as package shielding and low resolution, previously reported electric field microsensors are still not applicable for industrial static monitoring uses. In this paper, we introduce a newly designed microsensor package structure, which enhances the field strength inside the package cavity remarkably. This magnification effect was studied and optimized by both theoretical calculation and ANSYS simulation. By means of the digital synthesizer and digital coherent demodulation method, the compact signal processing circuit for the packaged microsensor was also developed. The meter prototype was calibrated above a charged metal plate, and the electric field resolution was 5 V/m, while the measuring error was less than 3 V, from −1 kV to 1 kV in a 2 cm distance. The meter was also installed into a production line and showed good consistency with, and better resolution than, a traditional vibratory capacitance sensor.
