The Role of Complementary Potential in Plasma Nitriding Processes of Technical Titanium

Abstract

This article deals with the testing of surface layers produced on technical titanium Ti99.2 under glow discharge conditions. In order to determine the effect of process temperature on the produced surface layers, nitriding processes were carried out at 700°C and 800°C and for 3 and 5 hours. The research results on evaluating the properties of the obtained surface layers and the characterization of their morphology were presented. The impact of the adopted nitriding process variant on the quality of the obtained layers was evaluated. It was demonstrated that the use of the supplementary potential during the ion nitriding process reduces the unwanted edge effect, which results in a significant increase in the homogeneity of the nitrided layers and improves the functional properties of the technical titanium Ti99.2.

Keywords

• plasma nitriding
• active screen
• titanium
• ion nitriding