Nanomaterials (May 2022)

A Bi<sub>2</sub>Te<sub>3</sub>-Filled Nickel Foam Film with Exceptional Flexibility and Thermoelectric Performance

  • Taifeng Shi,
  • Mengran Chen,
  • Zhenguo Liu,
  • Qingfeng Song,
  • Yixiang Ou,
  • Haoqi Wang,
  • Jia Liang,
  • Qihao Zhang,
  • Zhendong Mao,
  • Zhiwen Wang,
  • Jingyvan Zheng,
  • Qingchen Han,
  • Kafil M. Razeeb,
  • Peng-an Zong

DOI
https://doi.org/10.3390/nano12101693
Journal volume & issue
Vol. 12, no. 10
p. 1693

Abstract

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The past decades have witnessed surging demand for wearable electronics, for which thermoelectrics (TEs) are considered a promising self-charging technology, as they are capable of converting skin heat into electricity directly. Bi2Te3 is the most-used TE material at room temperature, due to a high zT of ~1. However, it is different to integrate Bi2Te3 for wearable TEs owing to its intrinsic rigidity. Bi2Te3 could be flexible when made thin enough, but this implies a small electrical and thermal load, thus severely restricting the power output. Herein, we developed a Bi2Te3/nickel foam (NiFoam) composite film through solvothermal deposition of Bi2Te3 nanoplates into porous NiFoam. Due to the mesh structure and ductility of Ni Foam, the film, with a thickness of 160 μm, exhibited a high figure of merit for flexibility, 0.016, connoting higher output. Moreover, the film also revealed a high tensile strength of 12.7 ± 0.04 MPa and a maximum elongation rate of 28.8%. In addition, due to the film’s high electrical conductivity and enhanced Seebeck coefficient, an outstanding power factor of 850 μW m−1 K−2 was achieved, which is among the highest ever reported. A module fabricated with five such n-type legs integrated electrically in series and thermally in parallel showed an output power of 22.8 nW at a temperature gap of 30 K. This work offered a cost-effective avenue for making highly flexible TE films for power supply of wearable electronics by intercalating TE nanoplates into porous and meshed-structure materials.

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