Mechanism of defect formation during friction spot joining of 3D-printed TC4 alloy and ultra-high molecular weight polyethylene

X. Zou; M.Y. Jiang; K. Chen; B.X. Chen; K.M. Reddy; S.Y. Zhang; K. Kondoh; M. Wang; X.M. Hua; L.T. Zhang; A.D. Shan

Materials & Design (Oct 2020)

Mechanism of defect formation during friction spot joining of 3D-printed TC4 alloy and ultra-high molecular weight polyethylene

X. Zou,
M.Y. Jiang,
K. Chen,
B.X. Chen,
K.M. Reddy,
S.Y. Zhang,
K. Kondoh,
M. Wang,
X.M. Hua,
L.T. Zhang,
A.D. Shan

Affiliations

X. Zou: Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China; School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China
M.Y. Jiang: Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China; School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China
K. Chen: Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China; School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China; Corresponding author at: Shanghai Jiao Tong University (SJTU), School of Materials Science and Engineering (SMSE), 401 Material Building F, 800 Dongchuan Road, Shanghai 200240, China
B.X. Chen: Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China; School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China
K.M. Reddy: School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China
S.Y. Zhang: Department of Oral Surgery, Ninth People's Hospital, College of Stomatology, Shanghai Key Laboratory of Stomatology, Shanghai Jiao Tong University School of Medicine, No. 639, Zhi Zao Ju Road, Shanghai, 200011, PR China
K. Kondoh: Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaragi, Osaka 567-0047, Japan
M. Wang: Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China; School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China
X.M. Hua: Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China; School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China
L.T. Zhang: School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China
A.D. Shan: School of Materials Science and Engineering, Shanghai Jiao Tong University, No. 800, Dong Chuan Road, Shanghai, 200240, PR China

Journal volume & issue: Vol. 195
p. 108989

Abstract

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For the purpose of developing high-quality metal/polymer joints without defects to satisfy the strict requirement of biomedical application, 3D printed TC4 alloy was joined with non-polar ultra-high molecular weight polyethylene (UHMWPE) via friction spot joining (FSpJ). In this study, five sets of experiments with different joining temperatures were designed to figure out the formation mechanisms of defects. The joining temperature (TJ) histories were measured with K-type thermocouple inserted in the lap interface. Macro−/micro-scale defects in TC4/UHMWPE joints were analyzed. Numerical simulation was carried out to study the temperature distribution during joining and gap formation during cooling. Micro−/nano-scale interfacial bonding was characterized using scanning electron microscope and transmission electron microscope. Then, the formation mechanisms of defects were better understood. Macro-scale defects were shown as insufficient filling and bubbles. Insufficient filling is linearly related to the TJ which can be alleviated by applying higher TJ. However, when the TJ is >385 °C, large bubbles appear due to excessive and fast thermal degradation of UHMWPE. Meanwhile, micro-scale defect, appearing as continuous gaps caused by the shrinkage of polymer can be avoided by enhancing the micro-scale interfacial bonding.

Published in Materials & Design

ISSN: 0264-1275 (Print); 1873-4197 (Online)
Publisher: Elsevier
Country of publisher: United Kingdom
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering: Materials of engineering and construction. Mechanics of materials
Website: https://www.journals.elsevier.com/materials-and-design

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