Experimental investigation of cutting parameters dependence in diamond turning of monocrystalline silicon

Abstract

The machinability of brittle materials is strongly dependent on machining conditions. In the present work, we perform ultra-precision single point diamond turning experiments of monocrystalline Si(100) using diamond cutting tools. The machined surface quality is characterized by evaluating surface topography and surface integrity. Systematic investigation of cutting parameters dependence of machining results is performed by considering rake angle of cutting tool, depth of cut and spindle speed. Experimental results suggest an optimized combination of cutting parameters for the best surface quality of Si(100) by diamond turning.

Keywords

• monocrystalline silicon
• diamond turning
• surface integrity
• rake angle